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Anatech USA

Plasma Cleaning. Surface Engineering. Sputter Systems

1395 Greg Street, Suite 110
Sparks, NV 89441

click for phone  |  Fax: (510) 401-5994

www.anatechusa.com

About Anatech USA

Anatech USA's mission is to provide technical solutions for surface engineering challenges.

Anatech USA delivers high vacuum systems with graphic state-of-the-art, "Touch-Panel" intuitive control packages. Every effort is made to tailor the system to meet your needs and budget requirements.

Thin Film Deposition equipment for metals and dielectrics, using Planar Magnetron sources powered by DC and/or RF supplies. Electron Beam and Thermal Resistance source systems are also available.

Gas Plasma vacuum systems with quartz or aluminum chambers. Systems are designed to clean at the molecular level, activate surfaces or etch surfaces.

Anatech USA works to deliver systems with consistent value and quality that meet or exceed our customer's expectations.

Products by Anatech USA

By Anatech USA

Plasma Systems A Gas Plasma may form whenever gas is exposed to an electric field. If the field is sufficiently strong, a high percentage of gas atoms will surrender an electron or two and become ionized. The resultant ionized gas and liberated energetic electrons comprise the gas plasma or plasma. The ionized... Read more »

By Anatech USA

Substrate Preclean Plasma process is essential for substrate precleaning at the molecular level. No matter how many rinse steps are used after wet cleaning, some residue remains that can interfere with adherence between the substrate and adhesives, paints, and bonding of other materials. Inductively Coupled Plasma... Read more »

By Anatech USA

Molecular Level Cleaning Prior to Bonding, Potting, Printing, Marking, Painting Plasma Cleaning: Essential for substrate precleaning at the molecular level. No matter how many rinse steps are used after wet cleaning, some residue remains that can interfere with adherence between the substrate and adhesives, paints, inks, potting compound and bonding of other... Read more »

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