Anatech USA

1395 Greg Street, Suite 110
Sparks, NV 89441

About Anatech USA

Anatech USA's mission is to provide technical solutions for surface engineering challenges.

Anatech USA delivers high vacuum systems with graphic state-of-the-art, "Touch-Panel" intuitive control packages. Every effort is made to tailor the system to meet your needs and budget requirements.

Thin Film Deposition equipment for metals and dielectrics, using Planar Magnetron sources powered by DC and/or RF supplies. Electron Beam and Thermal Resistance source systems are also available.

Gas Plasma vacuum systems with quartz or aluminum chambers. Systems are designed to clean at the molecular level, activate surfaces or etch surfaces.

Anatech USA works to deliver systems with consistent value and quality that meet or exceed our customer's expectations.

Competitors of Anatech USA

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3DT LLC

3DT manufactures corona and plasma surface treatment systems designed to solve adhesion problems by increasing the surface tension on substrates and, thereby, greatly improving bonding for your printing, coating, laminating, adhesive and micro cleaning applications. 3DT’s standard and custom... Read More

Products by Anatech USA

By Anatech USA

A Gas Plasma may form whenever gas is exposed to an electric field. If the field is sufficiently strong, a high percentage of gas atoms will surrender an electron or two and become ionized. The resultant ionized gas and liberated energetic electrons comprise the gas plasma or plasma. The ionized... Read more »

By Anatech USA

Plasma process is essential for substrate precleaning at the molecular level. No matter how many rinse steps are used after wet cleaning, some residue remains that can interfere with adherence between the substrate and adhesives, paints, and bonding of other materials. Inductively Coupled Plasma... Read more »

By Anatech USA

Plasma Cleaning: Essential for substrate precleaning at the molecular level. No matter how many rinse steps are used after wet cleaning, some residue remains that can interfere with adherence between the substrate and adhesives, paints, inks, potting compound and bonding of other... Read more »