Polymer-to-Metal Bonding

Available from Plasmatech, inc

Plasmatech’s MicroTIE plasma enhanced chemical vapor deposition (PECVD) coating provides a “green” alternative for bonding or over molding metal components.

Surface preparation of metal components prior to bonding incompatible materials may require caustic chemical etchants or other costly conversion coatings to ensure good bonding to the base metal substrate. By depositing a thin polymerized coating it is possible to create a tie or interface layer which permits direct bonding or over molding to the metal surface. The resultant bond performance is excellent with results that often surpass those achieved with conventional methods.

Superior to other coating or conversion processes, Micro-TIE thin film is deposited directly onto a plasma pre-cleaned substrate without exposure to the atmosphere. This continuous multi-step process provides excellent adhesion to the base substrate with the polymerization occurring at an atomic level.

Plasmatech provides contract processing services, as well as a full line of low pressure gas plasma and parylene coating equipment. Process development services are available for unique or especially challenging surface engineering requirements.

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