FastelFilm PI 284 High Temperature Thermal Bonding Adhesive Film

FastelFilm PI 284 High Temperature Thermal Bonding Adhesive Film

FastelFilm PI 284 (284F/140C) is designed with a high melt point design offering 120C continuous operating temperature stability. FastelFilm PI 284 is a polyamide based thermoplastic adhesive system available in a wide range of film thicknesses and film delivery formats (rolls, narrow rolls, die cuts).

FastelFilm PI 284 can be used in applications where substrates can manage the higher heating temperature but require a higher continuous operating temperature. Because of its higher operating temperature, it can be considered for more robust electronics, industrial and automotive. FastelFilm PI 284 can be utilized as an adhesive interface bonding 2 substrates together or used as an interface perimeter sealing gasket.

As a dry-to-the-touch adhesive film, FastelFilm PI 284 can be die cut to match a wide range of mounting and sealing applications areas. Once the adhesive pad is heated to or past its melt point temperature and cooled, the adhesive is set.