Thermal Interface Material
Available from Fralock
Thermally conductive materials and thermal management systems are designed
to remove the heat generated by an electronic devices (such as a power transistor
or microprocessors) to the ambient environment in order to ensure the reliable
operation of the system.
Fralock provides product solutions to control and manage heat in electronic assemblies
and printed flex circuit boards. Fralock converts interface materials with greater conformability, higher thermal performance and easier application.
Gap Pad provides an effective thermal interface between heat sinks and electronic
devices where uneven surface topography, air gaps and rough surface textures are
present. Eliminating air gaps, to reduce thermal resistance and high conformability, to reduce interfacial resistance, are essential in your thermal management product.