About AmTECH Microelectronics Inc
AmTECH MICROELECTRONICS, INC. was founded in 1993, to provide Advanced Manufacturing for high complexity next generation products from “Prototype to Production”. Our Silicon Valley facility includes a 2,500 square feet cleanroom with on-site Engineering Process Development and high-quality U.S. Manufacturing.
Full Automation for MICROELECTRONICS and ADVANCED PACKAGING including, Die Attach, Flip Chip, Multi-Chip, Gold Ball Wire Bonding, Aluminum Wedge Wire Bonding, Glob Top, Dam & Fill, Underfill, UV dispense and encapsulation.
Full Automation for SMT ASSEMBLY with 01005, BTC, BGA, uBGA, CSP, and Flip Chip components on PCB, Rigid-Flex and Flex substrates.