Printed Circuit Boards
Available from PVA TePla America Inc
Plasma treated PCBs increases the surface energy of advanced materials, including fluoropolymer, providing excellent lamination, wettability and metalization through-holes without the use of wet chemicals.
Plasma desmear and etch-back by plasma is an established practice in the PCB industry. Drilling vias through multilayer PCB’s leaves residue, or smear, on the via walls. This smear must be removed before metallization (to establish electrical connectivity) can occur. Gas plasma readily cleans smear in through-vias by the activation of oxygen and fluorinated compounds such as CF4. PVA TePla’s unique electrode design also ensures excellent plasma treatment uniformity, not only across each board, but also from one board to another and from process to process.
Metallization of through-vias is often impeded by carbonaceous deposits formed during laser drilling. To remove these deposits from vias, the printed circuit boards are immersed into gas plasma.
Teflon® (Polytetrafluoroethylene) , with its very low dielectric constant, is an excellent material to ensure fast signal propagation and superb isolation properties. The defining properties of Teflon®, however, also mean that it is difficult to plate. PVA TePla has developed a proprietary gas plasma recipe that provides excellent wettability of Teflon®, and with an activation lifetime much longer than standard plasma processes that use N2 and H2 reactant gases.