Mill-Max is the leading US source of precision-machined interconnect components including: IC Sockets (SIP, DIP, PGA, BGA,PLCC), spring-loaded probes & contacts, board-to-board interconnects & pin headers, PCB pins & receptacles, solder terminals, wrapost receptacles & terminals, and USB connectors.
Smiths Interconnect is a leading provider of technically differentiated electronic components, subsystems, microwave and radio frequency products that connect, protect and control critical applications in the commercial aviation, defense, space, medical, rail, semiconductor test, wireless... Read More
We design, manufacture, test and sell semiconductors – key ingredients in things you experience every day. Customers count on us to deliver the products and system designs they need to create innovative, differentiated applications – from robots to refrigerators, from drones to door locks. Our...
Anritsu’s mission is to significantly advance product quality and to assure consumer safety from foreign materials. Manufacturers worldwide rely on our contaminant detection and quality inspection equipment. With over 50 years of experience and 130,000 global installations, our leading-edge...
When the power is on, you don’t want shock or vibration to create spurious signals. Mill-Max Spring-loaded Connectors provide a reliable electrical connection in the most rigorous environments: • Maximum Continuity: Precision-machined gold-plated components and a low-resistance spring... Read more
Mill-Max now offers a series of rugged spring pins capable of carrying 9 amps continuous current at a low 10° C temperature rise. The Mill-Max 0850, 0851, 0852 and 0853 spring pins are the perfect solution for rugged applications and for use in circuits operating at currents above signal... Read more
Mill-Max is pleased to announce the addition of three new large scale, high current spring pins to our expanding family of ruggedized spring-loaded products. In contrast to our miniature spring pins, which are typically used on .100” (2.54 mm) centers, these new offerings are for applications... Read more