Medical Device Directory

Laser Direct Structuring

Available from LPKF Laser & Electronics

The part is molded in a standard mold using LDS-grade resin that can be laser activated, the desired interconnect pattern is directly written on the molded part utilizing the LPKF’s scanner based laser systems, and the conductive paths are plated using industry standard electroless plating technology. The plating adheres only where the plastic has been activated by the laser.

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