Available from Flexible Circuit Technologies
Depending on your specific circuit needs, Flexible Circuit offers a wide array of assembly options at our Asia based Assembly facility. Assembly types include the following:
Surface Mount Components – Passives, I/C’s, LEDs and connectors are examples of surface mount technology (SMT). SMT is a method for constructing electronic circuits in which the components are mounted directly onto the surface of printed or flexible circuits.
Flip Chip on Flex – A chip packaging technique in which the active area of the chip is "flipped over" facing downward. Instead of facing up and bonded to the package leads with wires from the outside edges of the chip, any surface area of the flip chip can be used for interconnection, which is typically done through metal bumps of solder, copper or nickel/gold.
Through Hole Components – Often accomplished through hand assembly, through hole assembly is the process of fitting components with wire leads into holes in the circuit and then soldering them into place.
FCT also provide testing services and further beyond assemblies we support our customers with product module and complete box build programs.