Mill-Max is the leading US source of precision-machined interconnect components including: IC Sockets (SIP, DIP, PGA, BGA,PLCC), spring-loaded probes & contacts, board-to-board interconnects & pin headers, PCB pins & receptacles, solder terminals, wrapost receptacles & terminals, and USB connectors.
America II partners with the world’s top manufacturers and serves as a primary supplier for OEM and EMS customers around the world. With 4 billion parts in stock and ready to ship, America II is one of the world’s largest distributors of semiconductors and electronic components. We have the... Read More
Regloplas NA, based in St Joseph, MI, is a wholly owned subsidiary of St. Gallen Switzerland based Regloplas AG. For over 50 years, Regloplas has designed and produced state of the art water, pressurized water, and oil mold temperature controllers and chillers. Used by the world’s finest... Read More
LEMO is the acknowledged leader in the design and manufacture of precision custom connection solutions. LEMO's high quality push-pull connectors are found in a variety of challenging application environments including medical, industrial control, test and measurement, audio-video, and...
When the power is on, you don’t want shock or vibration to create spurious signals. Mill-Max Spring-loaded Connectors provide a reliable electrical connection in the most rigorous environments: • Maximum Continuity: Precision-machined gold-plated components and a low-resistance spring... Read more
Mill-Max now offers a series of rugged spring pins capable of carrying 9 amps continuous current at a low 10° C temperature rise. The Mill-Max 0850, 0851, 0852 and 0853 spring pins are the perfect solution for rugged applications and for use in circuits operating at currents above signal... Read more
Mill-Max is pleased to announce the addition of three new large scale, high current spring pins to our expanding family of ruggedized spring-loaded products. In contrast to our miniature spring pins, which are typically used on .100” (2.54 mm) centers, these new offerings are for applications... Read more